Carousel type molding machine Fico AMS-LM Top Foil

adjustableautomatic

In line with the market trend of larger substrates, Besi Netherlands has introduced a new large substrate molding machine with Top Foil functionality, to mold single sided MAP products like BGA, QFN and BOC. The unique Top Foil feature on this machine allows bleed free production of bare die products. Top Foil A special foil, guided over the top mold, creates a soft sealing layer between mold and products. As a result, the die stays clear of compound. The use of top foil eliminates an extra cleaning process step after molding. The Fico AMS-LM Top Foil can handle substrates of up to 102 x 280 mm and can handle all current single sided packages. Key Features Cassette Handler • High capacity • Freely accessible • Slot to slot copy • Two or four deck version • Bar code and RFID reader (optional)   Vision • Leadframe orientation check • Mark inspection • Optical Character Verification (OCV)   Leadframe Handler • Automatic orientation correction • Leadframe pre-heating • Anti warpage leadframe cooling • Air cushion transport   Molding Press • Large substrate molding • Top Foil • Topedge molding (low viscosity compounds) • Adjustable high clamping force • Dynamic Clamping Control (Flip Chip Bare Die) • 17 process patents • Board and cavity vacuum • Individual, equal board clamping