Single station molding machine FML

automatic

The new Fico Molding Line (FML) is a transfer molding system for wafers and large panels. It can mold wafers of up to 12" (305mm) and panels up to 300x340mm. The Fico Molding Line can mold both overmolded and exposed die products in the same mold configuration, something that is not possible with compression molding. 100µm cap height The FML uses a conventional transfer molding concept to overmold products. With the standard top foil addition it can also perfectly mold exposed die products. Fill heights, as low as 100µm, and small gaps between dies, as low as 50µm, can be achieved. Despite the small cap height and the large molding surface, the end product remains free from voids, flash or bleed. Even extreme low vicosity compounds are no problem for the FML, the end product will be perfect of quality, outperforming liquid or powder compression molding. Advanced handling capabilities, a high precision mold with several vacuum systems allow also trouble free production of molded underfill products. Substrates, glass and silicon The Fico Molding Line is able to mold substrates, standard silicon and glass wafers. With its advanced clamp force and level control, it can also handle extreme thin and sensitive stacked wafers. Manual and automatic system The Fico Molding Line is already available as a manual system for product development. An automatic system is being optimized and in beta test at several customer sites. It will be released later. With the new modular FML design, a manual system can be upgraded to an automatic system when production ramps up. Key Features Wafers and panels •Wafer diameter up to 305 mm (>12”) •Panel size up to 300 x 340 mm