Eutectic die bonder Datacon 2200 evo plus

multi-chip for flip chipfor die-attachepoxy

The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. •PLUS accuracy •PLUS productivity •PLUS flexibility •Multi-chip capability •Flexibility for customizing •Open platform architecture Integrated Dispenser •Pressure/time (Musashi®), Auger, Jetter types available •Epoxy stamping option •Filled and unfilled epoxy, wide viscosity range •Small footprint, low cost-of-ownership •New high-speed image processing unit •Full alignment & bad mark search •Pre-defined fiducial geometry & customized teaching Automatic Wafer and Tool Changer •Fully automatic cycle for multi-chip production •Up to 7 pick & place tools (optionally 14), 5 eject tools •Stamping tools and calibration tools possible •Die attach, flip chip and multi-chip in one machine •Die pick from: wafer, waffle pack, Gel-Pak®, feeder •Die place to: substrate, boat, carrier, PCB, leadframe, wafer •Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic