Fully-automatic die bonder Datacon 8800 FC QUANTUM advanced

flip-chiphigh-accuracy

As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets the benchmark for speed and productivity with its new Datacon 8800 FC QUANTUM advanced. The state of the art motion control, unique CRYSTAL - glass based fluxer - concept and enhanced computing power showcases the fastest and most cost effective Flip Chip system available today. •Highest UPH up to 9000, including dip fluxing •Full process and yield control •Proven 5µm accuracy Unprecedented Speed •Unique patent pending CRYSTAL concept (glass based fluxer with simultaneous inspection) •Enhanced trajectories and motion control •Highest speed with full process control Full Yield Control •Full Process & Production control •Superior usability with enhanced Pseudo X-Ray •Fast Post Bond Inspection Proven production Accuracy •5µm accuracy at highest speed •Lowest vibration with SMART path filtering •Enhanced Matrix BMC test Shortest Lead time •4 Weeks lead time •Lean production process •Aligned with proven Besi production process •Uniform QA system installed at contract manufacturers