High-accuracy die bonder Datacon 8800 CHAMEO advanced

automatedmulti-chip for flip chip

As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control. The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs. Key Features Multi-Chip – Combining Speed, Flexibility and Accuracy • Multi-chip capability – Flexibility on smallest footprint • Single pass is king – Improve your Cpk for multi-FC packages • Waffle pack feeders – Extend your possibilities • Extra Speed up to +40% Enhanced Capabilities – Ready for the Future • Thermo-compression – No limits for your applications • Leadframe, strip, boat, wafer – No limits for your substrates • Customized features – Exactly tailored for your process • 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier • Face-down & Face-up (recipe controlled) • Clean room class ISO 5 • Foup load port • Tape & Reel Highest Accuracy – Capturing Tomorrow’s Markets • Highest Accuracy ± 5 µm / 3 µm @ 3 Sigma – For fine-pitch and TSV applications • Local reflow – Mastering sophisticated assemblies • Long-term stability – Securing high yield at high speed