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Singulation machine FSL

Singulation machine - FSL - BE Semiconductor Industries N.V.
Singulation machine - FSL - BE Semiconductor Industries N.V.
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Description

With the launch of the improved Fico Sawing Line (FSL), Besi initiates yet another era in singulation. The FSL is the only integrated singulation system on the market of a single solution provider. Singulation is a 4 step process where - from a large strip - individual products are sawn, cleaned, inspected and sorted. In the Fico Sawing Line, Besi has integrated all these process steps into one single machine. With its compact size the FSL has the highest output per square meter. The FSL carries out all process steps simultaneously using reliable vacuum on each single product, instead of tape. The unique and patented sawing method has the best scrap handling in the market and an unsurpassed accuracy. 100% inspection ensures that only perfect products leave the machine. With the FSL, singulation is elevated to an art, the art of singulation. Key Features Main improvement features • Extreme warpage handling (best warpage handling in the market) • Improved output with new 9-head sorting • Improved accuracy - 25 μm offset/size accuray optionally available • Step cut application (option)     High Output • Fully parallel processing with dedicated units • Balanced throughput with optimal process performance • Production output up to 34,000 UPH   Large Substrate Handling • Capable of handling substrate sizes of up to 100 x 300 mm • Fully prepared for future increase of high density substrate approach   Fast Conversion • Fast & easy product conversion to different substrate & product size • No tools required and completely automatic alignment of all product related parts
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.