With an installed base of over 350 EDF/EPL systems, Meco has set the industry standard for leadframe solder plating. The system is fully customized to your specific needs and is a green solution, with low power consumption and minimal chemical usage.
The Meco Electro DeFlash and Electro Plating Line are designed for the future and are capable of handling any kind of leadframe product. Any leadframe size up to 110 x 315 mm can easily be handled on the Meco EDF/EPL.
Setting the Standard in Leadframe Solder Plating
Meco has become the industry standard for leadframe solder plating with an installed base of over 250 of these computer controlled EDF/EPL systems, and still growing strong. In the past, leadframes were plated by hot dip or rack plating, either in hand or in hoist operated plating installations. Apart from being a labor-intensive operation, the biggest problem is the uneven thickness distribution of the solder finish. Much of the success of subsequent soldering depends upon the purity and the right amount of thickness of the tin-alloy. Too little thickness: the deposit will not pass accelerated aging tests. Excessive thickness on fine leds for SMT may cause bridging during actual soldering. Uneven thickness distribution is caused by: A) rack design and uneven anode position; B) variable strip length and width of leadframe creating gaps between two strip ends resulting in "dog-boning" effect. The ideal solution for solder plating cut strips of leadframes would be a simulation of a fully continuous reel to reel plating system.