Fully-automatic die bonder Datacon 2200 evo hS

multi-chip for flip chipfor die-attachepoxy

The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Datacon 2200 evo goes hS! •Multi-chip capability •Flexibility for customizing •Open platform architecture •Fully automatic cycle for Multi-chip production •Up to 7 Pick & Place tools (optionally 14), 5 eject tools •Pressure/time (Musashi®), Auger, Jetter type dispensers available •Epoxy stamping option •Filled and unfilled epoxy, wide viscosity range •New high-speed image processing unit •Full alignment & Bad mark search •Pre-defined fiducial geometry & customized teaching •Die Attach and Multi-Chip in one machine •Die pick from: wafer, waffle pack, Gel-Pak®, feeder •Die place to: substrate, boat, carrier, PCB, leadframe, wafer •Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic