Multi-chip for flip chip die bonder Datacon 2200 evo hF

The all new Datacon 2200 evo hF is the ultimate multi-chip Die Bonder solution for high bonding force applications. Flexibility The Datacon 2200 evo hF is the most versatile machine for applications like Power Modules, IGBT, MCM and SiP. It is highly configurable with integrated dispenser, SEMI-conform 12" wafer handling, multiple pick- & place and eject tools, I/O systems and application specific options. Accuracy & performance The Datacon 2200 evo hF sets new benchmarks in its class, with an increased bond force of up to 500N and outstanding machine accuracy of ±10 µm @ 3s. The Datacon 2200 evo hF can be equipped with everything required for your application's successful mass production. The Datacon 2200 evo hF is ready for today's and tomorrow's processes and products. Key Features High force bonding • Bond force 500 N • Hot bond head • Closed loop process control (force and temperature control)   Sintering • Sinter film handling • Sinter paste dispensing • Pre-applied sinter paste   Heating • 450°C tool • 300°C substrate