Flip-chip die bonder Datacon 8800 FC QUANTUM hS

automated

Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000 A Datacon QUANTUM system for your product Seeing is believing, so we are more than happy to give you a demonstration on a live system in the Datacon QUANTUM range of flip chip equipment. Key Features Extra Speed +100% Improved CoO • Innovative "Quattro" multi nozzle concept  • Synchronous process steps  • High resolution large FoV camera systems  • Cluster adjust capability for bonding position alignment    Accuracy • Proven accuracy 4μm @ 3s • Enhanced 26MP camera system  • Optimized movements with Real Cross Influence • New Matrix BMC 2.0      Full Yield Control • Full Process & Production Control • Superior usability with enhanced Pseudo X-Ray • Fast Post Bond Inspection • Individual Eject - Flip - and P&P - Toolinspection • Chipping - / Die Crack detection    Ease of Use • Minimal tooling quantity - fast device change over  • No die transfer shuttle - no intermediate steps • Simple recovery handling  • Auto nozzle offset correction