The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.
PLUS accuracy
PLUS productivity
PLUS flexibility
Multi-chip capability
Flexibility for customizing
Open platform architecture
Integrated Dispenser
Pressure/time (Musashi®), Auger, Jetter types available
Epoxy stamping option
Filled and unfilled epoxy, wide viscosity range
Small footprint, low cost-of-ownership
New high-speed image processing unit
Full alignment & bad mark search
Pre-defined fiducial geometry & customized teaching
Automatic Wafer and Tool Changer
Fully automatic cycle for multi-chip production
Up to 7 pick & place tools (optionally 14), 5 eject tools
Stamping tools and calibration tools possible
Die attach, flip chip and multi-chip in one machine
Die pick from: wafer, waffle pack, Gel-Pak®, feeder
Die place to: substrate, boat, carrier, PCB, leadframe, wafer
Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic