Surface grinding machine IVG series

semi-automatic2-axishigh-precision

Semiautomatic Double-axis Grinding Machine is a high-precision grinding machine which is equipped with two grinding wheel shafts, has the function of automatic thickness measurement and compensation system, manual loading, moving to fine grinding position after rough grinding, grinding wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications. Complete function Automatic thickness measurement and compensation, multistage grinding program, waiting under overloading and other function, meeting various process requirements. Double-axis System Two grinding wheel shafts, no need to replace grinding wheels to realize rough and fine grinding. Simple operation PC industrial computer system, touch screen control, one- button automatic grinding process in addition to manual loading and unloading. Good compatibility Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials.