Surface grinding machine IHG-2010

horizontalautomatic1-axis

The horizontal grinding machine is a small, high-precision grinding machine with high cost performance in manual loading, the grinding wheel shaft is installed in a horizontal way, the wafers are manually loaded, and the removal of grinding is controlled by grinding wheel feed. The operating table can be customized according to customer requirements and has a wide range of applications. Complete function Multistage grinding program, waiting under overloading and other function, meeting various process requirements. Simple operation PC industrial computer system, touch screen control, one- button automatic grinding process in addition to manual loading and unloading. Good compatibility Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials. High cost performance Ensure that process cost is reasonable and optimized.