POLI-500 is a small 8 inch chemical mechanical polishing machine, which adopts manual loading method, can optionally be equipped with semiautomatic loading pallet, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
Complete functions
Put membrane back pressure on the wafer, polishing plate has built-in cooling system, swing arm dresser and friction & temperature detection endpoint monitoring function is optional.
Simple operation
PC control system, touch screen control, semiautomatic loading pallet is optional, one-button automatic CMP polishing.
Good compatibility
3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4, 6 & 8 inch polishing head, compatible with different sizes and types wafers.
Small floor space
Minimize the floor space of clean room.