Bonding system TWB series

This machine is a high-precision desktop wax bonding machine in manual waxing and placing, with heating and cooling function, automatic pressing, uniform wax layer. The vacuum waxing function can be upgraded, vacuuming first, hot pressing and cooling, the waxing effect is better. Complete functions Equipped with heating table, pressing plate and water-cooling pipe. Simple operation PLC control system, manual waxing and placing, bonding process of pressing and cooling automatically Good compatibility Compatible with various size of wafers below 150mm in diameter and bonding process of various semiconductor materials Small floor space Desktop design, space occupation is small in the clean room.