Brush cleaning machine Cleaner series

automaticfor wafershigh-speed

These series machines are special cleaning machines after wafer CMP. They have different structures such as single station type, index type, and in-line type, can be used in different applications, the in-line type machine is equipped with fully- automatic loading and unloading system. These series machines are equipped with rinsing, double-side brushing, megasonic cleaning, N2 drying, high-speed spin-drying functions, high integration, small foot space, wet in and dry out, suitable for cleaning all kinds of wafers after CMP. Complete functions These series machines are equipped with rinsing, double-side brushing, megasonic cleaning, N2 drying, high-speed spin-drying functions. Simple operation PLC system, touch screen control, one-button automatic brushing and cleaning, the in-line type machine is equipped with fully-automatic loading and unloading system, “cassette to cassette”is more convenient. Good compatibility Compatible with 4 to12 inch wafers by changing the fixture Small foot space Minimize the foot space in the clean room