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Silicon polishing machine TAP seriesfor semiconductorsfor waferssingle
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Characteristics
- Machined material
- silicon
- Applications
- for semiconductors, for wafers
- Associated function
- single
- Other characteristics
- single-sided, rotating table, double-head, high-speed
Description
These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, can polish one or multiple wafers and meet the high-precision polishing requirements of various materials.
Cast iron body, high equipment stability
Rotation and swing function of polishing head
High-speed polishing
Man-machine conversation operation interface, comprehensive functions and easy operation.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.