Metal polishing machine POLI-400L

precisionrotating tablesmall-scale

POLI-400L is small size chemical mechanical polishing machine for 4&6 inch, which adopts manual loading method, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, are used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide. Complete functions Put membrane back pressure on the wafer, polishing plate has built-in cooling system, swing arm dresser and friction & temperature detection endpoint monitoring function is optional Simple operation PC control system, touch screen control, manual loading, one-button automatic CMP polishing. Good compatibility 3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4 or 6 inch polishing head, compatible with different sizes and types wafers. Small floor space Minimize the floor space of clean room.