Bonding system TLB-360S

This machine is a semiautomatic liquid wax bonding machine in manual loading, dripping wax, spinning wax, baking and bonding automatically, silicone airbag pressing wafer, good waxing effect and high precision. It is suitable for wax bonding of various semiconductor substrate materials before polishing. Silicone airbag pressing, wax bonding in high precision Simple operation PLC touch screen control, one-botton automatic wax bonding process after manual loading Good compatibility Compatible with 2 to 6 inch wafer, can be changed in the program. Small floor space Minimize the floor space in the clean room.