The soldering worktable Bga900-IR is produced by our organization which is warming by infrared beam in twofold sided, can warm from the top and preheat at the bottom. Suit to welding, evacuation or repair BGA, PBGA, CSP and assortment of bundles, can meet the multi-layer PCB substrate and unleaded welding necessities. Setup could be finished on the planting table BGA to plant the ball. The gadget repair welding`s fundamentally target is motherboards and illustrations chip BGA of PC, desktops and switches.