Wafer spin coater TJ1200

Semiconductors, ICs and laser brand names can be manufactured using the Digital Spin Coater. Sensitive emulsion can be daubed on the substrates like silicon and ceramic chips, sheet glass and photomasks. The excrescent sensitive emulsion dripped on the substrate can be removed by tail-wagging by using centrifugal force. Using the same centrifugal force and some tension on the sensitive emulsion's surface, a glue film can be formed. This operation is extremely convenient and can be performed with great efficiency. Track speed and time are flexible and can be changed as desired. The machine is stable, boasts a robust structure and has seamless circumrotation and has a digital display that shows time and rotation speed. It can be used with a photetch machine. For more details, contact us.