PECVD deposition machine DynaJet

PVDsputteringmetalized film

The DynaJet is the newest member of the Dyna family of metallizing systems. This batch sputtering system combines the best of all physical vapor deposition (PVD) expertise Bühler has to offer. Rotatable cathodes provide a new dimension in productivity. The high target utilization offers lower cost of ownership due to a long target lifetime. The turbomolecular pump system (TMP) needs only a fraction of the electrical energy and cooling water required by conventional systems. All this results in a significant reduction of yearly ownership costs. Long lifetime and fast target exchange thanks to innovative design -The new target design offers a target utilization of 70-80 % as compared to the previous version, which offered just 25 % utilization. Additionally, the rotatable cathode design can increase target lifetime as much as four times. Enhanced processes provide high-speed coating and best PVD homogeneity -The long rotatable cathode and optimized cryo-coil guarantee the best PVD homogeneity. A semi-transparent sputter layer is another possible application. The optimized Bühler Arc management ensures a stable sputtering process. New developments in the plasma-enhanced chemical vapor deposition (PECVD) process enable high-speed top-coating. A further key element is the efficient three-stage pre-vacuum pumping system. New pump system offers excellent energy efficiency -Average energy consumption is an important aspect of cost of ownership. The new pump system of the DynaJet with TMP saves 800000 kW/h in 10 years as compared to other machines on the market.