APPLICATIONS:
Semiconductor Wafer Cleaning (Wet Bench) Processes
Heating of Photo-Resist Removal Solvents
DI water Heating for Wafer Rinsing
Air and Nitrogen Heating for Wafer Drying
Heating of Acids, IPA, Piranha, NMP, etc.
For Use with Single Pass or Recirculating Systems
FEATURES & BENEFITS:
Fluid Path has No Contact with Heating Elements
Media is Isolated in PFA (Teflon®) Flow-Tube (High Purity Heating)
Allows for Safe Heating of Dangerous Liquids & Gases
Flow-Tube is Safe for Use with Many Caustic Solvents
Flow-Tube Is Field Replaceable (No Service Call Required)
Compatible with Standard Controls (PID, PLC, Multi-Loop, etc.)
Body is Teflon® Coated, for Maximum Cleanliness
Self-Draining Flow-Tubes, and Long-Life Heating Elements
SPECIFICATIONS:
Power:
1.5 kW Total to 4.5 kW Total
Voltage Range: 120 - 415 V
Max Line Current: 30 A per circuit
Tubing:
.375” OD (3/8”) (9.52 mm)
.031” Wall (.80 mm)
Overall Process Tube Length: 190" (4826 mm)
PFA (PerFluoroAlkoxy) / Teflon® (standard)
High Purity PFA (optional upgrade)
Max Pressure: 70 psi (4.82 bar)
Body:
Aluminum with Black Teflon® Protective Coating
Enclosures:
NEMA 7 (explosion-proof)
Max Working Temperatures:
392°F (200°C)
Sensors:
K or J Type Thermocouples Standard (Qty. 3)
1 for Process Control
1 for High-Limit Protection
1 for Tube Temperature Protection
Available Accessories:
Insulating Jackets
Straight Union Fittings