Equipment front end module EFEM

Equipment Front End Module (EFEM) System Features and Advantages * Damage-free automatic handling of wafers in magazines and between magazines. * Optional Bernoulli fingers for thinning wafers. * Customized production to meet customer needs. * Meeting customers’needs for multiple/different types of magazines and transfer of wafers with different sizes. * Provided with automatic opening mechanism for magazines * Provided with efficient filtering device (HEPA specification). * ESD protection meeting international IEC and ANSI standards. * Supporting semiconductor-related automation protocols. * Optional OCR module for Wafer ID, which can deal with barcodes, QR codes, numbers and letters. The equipment front end module is mainly used to realize automatic supply and unloading of wafers for semiconductor equipment, reduce production costs, improve production efficiency, while ensuring process accuracy and purification requirements. The system has automatic wafer scan- ning, automatic transfer and automatic calibration functions, can be provided with ID Reader (front and back) according to customer needs, and can be customized based on wafer size, magazine quantity and aligner type, etc. With independent integration, the Company is committed to provid- ing various wafer handling automation system solutions for customers in the semiconductor indus- try. The equipment meets the needs of the semiconductor industry, is compatible with international semiconductor communication protocols, supports SECS/GEM communication modules, and matches the information management requirements and unmanned management trends.