Fully-automatic glue dispensing machine GS600SU

underfillFCBGAFCCSP

Fully-Automatic Underfill Dispensing Machine Applied to Underfill process of flip chips GS600SU is a high-speed and high-precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP. The system strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and the glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the information management requirements. Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation The vacuum adsorption fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture. The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit Friendly human-machine interface design Positioning and detection functions Inspection before operation to avoid defective incoming materials Inspection after operation to prevent batch defects Application Fields: FCBGA Packaging CUF Application FCCSP Packaging SiP Packaging