Fully-automatic adhesive dispensing machine GS600M
for the semiconductor industryfor MEMSfor wafers

Fully-automatic adhesive dispensing machine - GS600M - Changzhou Mingseal Robot Technology Co.,ltd. - for the semiconductor industry / for MEMS / for wafers
Fully-automatic adhesive dispensing machine - GS600M - Changzhou Mingseal Robot Technology Co.,ltd. - for the semiconductor industry / for MEMS / for wafers
Fully-automatic adhesive dispensing machine - GS600M - Changzhou Mingseal Robot Technology Co.,ltd. - for the semiconductor industry / for MEMS / for wafers - image - 2
Fully-automatic adhesive dispensing machine - GS600M - Changzhou Mingseal Robot Technology Co.,ltd. - for the semiconductor industry / for MEMS / for wafers - image - 3
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Characteristics

Options
fully-automatic
Applications
for the semiconductor industry, for MEMS, for wafers

Description

Online Visual Dispensing Machine GS600M GS600M is a fully-automatic online dispensing platform developed based on the needs of the MEMS industry. It can provide one-stop solutions for on-line ASIC chip encapsulation, precision solder paste dispensing and multiple foolproof detection, etc. in the MEMS process. High-quality control of the entire production process is realized. The on-line workstation operation can also be selected. Yield Improvement Work positions are inspected before and after operation, and the final station is professionally inspected to achieve multiple fool proof. Full Automation The on-line mode is used to minimize manual intervention. Prevention of Whole Line Downtime Operation tracks / conveyor tracks are separated, so that shutdown of a single machine does not affect the operation of the whole line. Meeting Information Management Requirements Real-time MES system docking, production status information uploading, and system abnormal status alarm. Supporting SECS/GEM semiconductor communication protocol. Meeting Stringent Engineering Requirements Class-100 dustproof design ESD protection meeting international IEC and ANSI standards. Good shock absorption with mineral frame structure to effectively reduce the impact caused by high-speed movement. Chip Coating Applied to encapsulation glue jetting process of ASIC chips, etc. Solder Paste Painting Applied to Solder Paste Painting of SMD pads with special-shaped packaging, and Solder Paste Painting of sensor metal shells, etc Potting Applied to Potting process of sensor cavities, etc. Component Reinforced-gluing Applied to Reinforced-Gluing process of SMDs and Chips, etc.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.