Fully-automatic die bonder AC100

for micro assemblyhigh-accuracy

Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and shell-and-tube devices (shells, parts and components, etc.) The equipment can be provided with modules such as automatic loading & unloading and product pre-curing, and can automatically realize functions of automatic substrate loading & unloading, dispensing operation and glue shape detection, component mounting and mounting result detection, and product pre-curing. It is compatible with international semiconductor communication protocols. Operation Flow： Loading → Dispensing operation→Mounting operation→Unloading Note: The sequence of dispensing operation and mounting operation can be changed according to the process flow. The functions of product left-in right-out and right-in left-out are supported. Features and Advantages： * The dispensing station is compatible with piezoelectric valves / screw valves / squeeze valves / dispensing controllers, so the product has strong versatility and wide application range. * The tilting & rotation axis (optional) is provided to meet the requirements of side dispensing process. * ESD protection meets international IEC and ANSI standards. * The mounting head has pressure calibration and leveling functions to facilitate the quality control during production. The mounting head supports adsorption and gripper customization, and has a wide range of applications. * With optional parallel operation mode, the downtime of a single station does not affect the whole line operation during parallel operation