Reflow soldering oven KD-V8N

vacuumfor electronic componentsfor PCB

HVT's inline nitrogen vacuum soldering oven provides the best solution for power module device and automotive electronic device, semiconductor packaging, and others,help customers to slove the solder packaging problem , and achieve product soldeing with void-free and nonoxidation. Our Advantages Bottom heating plate is double-layer structure design,upper layer plate can be replaced and adjusted according to the requirement;Down layer for heating with 9 heating rods,each heating rod is customization & design , 3 pcs are a group,distributed on the left,middle, right,individual temperature set and control, each group is equipped with a temperature measurement thermocouple , distributed on the up-left,middleb, up-right,Effectiveld solve the problem of low temperature on the platform edge, that will with longer usage time, solve the problem of the big temperature difference between plaeform edge and middle ;platform temperature evenness structure and design is better, and long-term to use,the effect will more obvious , with stable temperature for long-term use;Temperature evenness is :±2℃. Power Module Device Vacuum Reflow Oven In a vacuum reflow oven, power modules are soldered in a controlled environment to prevent oxidation and improve solder joint reliability in power module devices. As these modules often handle high power and generate considerable heat, vacuuming during the reflow process can minimize oxidation and improve solder joint reliability.