Reflow soldering oven KD-V3/V5

vacuum

This multi-layer formic acid vacuum soldering reflow oven is suitable for batch power module device production. This semiconductor packaging reflow oven can be controlled separately for each layer, and provides void-free and non-oxidation soldering. Process control of a power module device reflow oven: 1. Temperature gradient and time of each stage when soldering , can freely programming and save based on needed. 2.Can automatically generate all process curves, and edit the process program. 3.With digital gas mass flow controller, that can accurately control the process gas flow rate. Temperature correction function: With intelligent temperature correction system ,that can compensate for temperature difference. 900~950 mm(Need same with chip mounter ,can confirm by agreement). Part of our advantage of multi-layer formic acid soldering reflow oven 1.Independent research vacuum chambers and valves, with rich experience for design , material choose, production process testing. 2.Our technical team with rich experience from SMT to Semiconductor circuit package process ,including Product soldering , soldering material, device surface treatment, setting of temperature and vacuum , and others. 3.Company have more than 200 workers ,Technical R&D personnel more than 40,till now with patent of invention 10, practical patents 20,1 software patent, 1 design patent , and patents in apply more than 15.