Reflow soldering oven KD-V400L

vacuumin-line

HVT inline 4 chamber vacuum soldering oven optimize IGBT modules with solder paste or preforming solder and the exceptional soldering result void rate will less than 3%. IGBT Module Vacuum Reflow Oven Customization: Maximizing Tray Space Utilization: Customizing tray space based on customer product dimensions to achieve maximum utilization. Hardware Adjustments for Increased UPH: Optimizing hardware components such as heating platforms and vacuum chambers to enhance production efficiency (UPH - Units Per Hour). Double-layer structure design: Upper layer (cover plate): Can be replaced and adjusted based on fixture requirements Lower layer (heating layer): Custom designed with 9 heating rods of 250W, divided into three groups, each group has 3 rods. Custom designed with 9 heating rods of 250W, divided into three groups, each group has 3 rods. Each group is equipped with a temperature-measuring thermocouple, positioned at the upper left, middle, and upper right respectively. Problem Solved: Effectively improves the edge temperature of the platform. Temperature difference issue between the edge and the middle after long-term usage.