Reflow soldering oven KD-V200

vacuumfor PCB

The reflow oven soldering process is a common means of attaching electronic components to printed circuit boards during assembly. It is also an integral part of surface mount technology (SMT) assembly, a process that is increasingly used in modern electronics manufacturing. During reflow soldering, solder paste is applied to the PCB pads where components will be installed. It consists of tiny solder particles suspended in flux. During the reflow process, flux is used to clean surfaces and promote solder wetting. Our Advantages • Effective solution for low temperature at platform edges and large temperature difference between edges and center. • Improved platform temperature uniformity and longevity of usage. • Long-term stability with temperature uniformity within ±2℃. • It can solve the issue of chip displacement during rapid pressure reduction. • During the vacuum evacuation of molten solder, it enables better control of the evacuation speed to reduce void formation. A vacuum solder reflow oven, or vacuum reflow soldering system, is a specialized type of reflow soldering equipment. It incorporates a vacuum environment during soldering. Using this technology, reflow soldering can be enhanced for certain applications or for components sensitive to oxygen and air. This is also true for components that require enhanced control. In a standard reflow oven, soldering occurs in a controlled atmosphere, typically nitrogen or nitrogen/hydrogen. As a result of this controlled atmosphere, solder and metal surfaces are not oxidized during reflow. This results in a more reliable and high-quality solder joint.