Reflow soldering oven KD-V43

vacuumfor PCB

1.Void Less Void reduction between the joining partner (<2%) to ensure better heat transfer (based on the device surface quality and the gas selection). If the void is less than 30%, the bonding strength increases. 2.Excellent temperature control PLC and MFC architecture ensure consistency and precision temperature control, as well as reliable protection. Water Cooling system : Cross-cooling tube and water cooling tank provide rapid cooling in high-temperature environments. 3.Very Short Soldering Times The welding cycle time is short, about 10 minutes (380-450 °C soldering temperature, cooling temperature to 45 °C, nitrogen filling, welding vacuum is below 5-10-1 Pa). 4.Variation in process gas Standard : 100% nitrogen is pumped into the vacuum chamber. Option: HCOOH, ArH2 Plasma process gas, N2 & H2 forming gas. 5. Good human-machine interface Windows provides system status queries, debugging/setting, alarms, and user interfaces. 6. Advanced PLC and Safe System: The PLC system prevents accidental leaks, such as hydrogen leakage. Alarms for excessive and ultultra-highmperatures Low pressure warning system for cooling water Protective covers for HCOOH tanks to prevent accidental explosions System for detecting leaks of hydrogen gas and formic acid Automatic pressure relief system in case of overpressure A hydraulic pallet prevents water from damaging circuits Automatic hydrogen burning prevents hydrogen pollution.