Field emission scanning electron microscope HEM6000

laboratoryfor materials analysisfor semiconductors

High-speed scanning electron microscope for cross-scale imaging of large-volume specimens CIQTEK HEM6000 facilities technologies such as the high-brightness large-beam current electron gun, high-speed electron beam deflection system, high-voltage sample stage deceleration, dynamic optical axis, and immersion electromagnetic & electrostatic combo objective lens to achieve high-speed image acquisition whilst ensuring nano-scale resolution. The automated operation process is designed for applications such as a more efficient and smarter large-area high-resolution imaging workflow. The imaging speed can reach more than 5 times faster than a conventional field emission scanning electron microscope (fesem). 1. Image Acquisition Speed：10 ns/pixel，2*100 M pixel/s 2. Resolution：1.3 nm@3 kV, SE; 1.5 nm@1 kV, SE，0.9 nm@ 30 kV, STEM 3. Acceleration Voltage：0.1 kV~6 kV (Deceleration Mode)，6 kV~30 kV (Non-deceleration Mode) 4. Field of View：Maximum 1*1 mm2，high-resolution minimum distortion 64*64 um2 5. Stage Repeatability：X ±0.6 um，Y ±0.3 um 6. Signal Electron Filtering System：SE/BSE signal-free switching, mixing with adjustable ratio 7. Fully Electrostatic High-Speed Beam Deflection System：High-resolution large field imaging achievable Maximum. Field of view up to 32um*32 um at 4 nm per-pixel 8. Sample Stage Deceleration Technology：Reduce incident electron landing voltage, increasing signal electron capturing efficiency 9.Electromagnetic & Electrostatic Combo Immersion Objective Lens Beam Deflection System：Objective lens magnetic field immerses sample, contributes low-aberration high-resolution imaging