Thermal paste and thermal dispensing (for CPU, GPU, etc)
Materials
Loaded silicone, different viscosities and thermal conductivities on request.
MANUFACTURING PROCESS
Silicone mixed with thermal conductive particules (metal or ceramic)
Prototyping
Perfect for prototype stage.
Options
Supply of only material (syringe, pot, cartridge).
Packaging
Syringes (to apply by hand) or automatic dispense on the equipment by our programmable robot.
Description
These thermal pastes are used for high technology projects with a high thermal conductivity expected (telecom, military, medical).
This high-performance product ensures an interface between CPU, GPU, other processors and the heatsink.
Thermal paste is directly dispensed on casting or PCB material for protection.
It can be used in syringe or dispensed using a technology digitally controlled 3 axes, which adapt dispensed thickness to accommodate the equipment topography.
This thermal paste is also used for overclocking CPU to ensure the best performances.