Nanosecond laser system FALIT®

solid-stateinfraredindustrial

CLC’s laser micromachining technology rooted in the world 1st wafer laser processing system in 1972. Since then, we’ve continued to evolve this technology in collaboration with our customers. FALIT® LASER APPLICATIONS Materials in the Semiconductor Industry It adapts to the widest range of epoxy mold compound and various types of fillers, keeping gold, silver, brass, or aluminum bonding wire, the silicon, GaAs, InP die undamaged. If you’re not sure if your material will work, send it in for a free material testing study by our application experts. The FALIT® comes in many configurations to meet your needs in semiconductor failure analysis. From tabletop options to multi-laser configurations. Our patented laser technology is the best solution for failure analysis labs. Specialized Laser Source Specialized Digital ICO Laser Source for the toughest of mold compounds. Designed specifically for this type of application to achieve the best possible results. Continuous Motorized Zoom High-resolution continual motorized vision system for inspecting micro components and filler compounds. Used for pin-point laser removal of mold and gel compounds. Video Microscope See exactly where the laser will remove compounds using the vision system. Control the exact position throughout the process. Acid Gasket Cutting Software Create your own gaskets quickly and effectively using the Acid Gasket Cutting module available for the FALIT® brand.