Heavy Cut Polishing Compound
Innovative abrasive formulation mordant grain, easy to use for the first polishing process. Abrasive mixture, with micro-granules it is recommended in presence of: sanding marks (up to grit P1500), parts heavily scratched or oxidizes by atmospheric agents. Silicone free. We suggest the use together with the HC-88 polishing pad for an excellent result with a unique gloss.