Chip LED SA1000

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Cree LED's Direct Attach™ SA1000™ LED chips are the next generation of solid- state LED emitters that combine highly efficient InGaN materials with Cree LED's proprietary device technology to deliver superior value for the general illumination and automotive exterior markets. The SA1000 LED chips are among the brightest in the market at a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down design allows for eutectic die attach, eliminating the need for wire bonds, enabling superior performance, improved thermal management and high reliabilty. The design is optimally suited for industry- standard top-view packages. FEATURES • Direct Attach LED Technology, no wire bonding • High Reliability - Flux Eutectic Attach • Junction-Down design minimizes Rth for Improved Thermal Management • Direct Attach LED RF Performance: - 450 nm - 510+ mW • Low Forward Voltage (Vf) - 2.9 V Typical at 350 mA • Maximum DC Current (lf) - 1500 mA • AuSn bond pad metal for Eutectic Attach APPLICATIONS •General Illumination - White LEDs - Chip-on-Board (COB) - Multi-chip Arrays - High Voltage Arrays •Automotive Exterior - Headlamps - Daytime Running Lights - Fog lamps - After-market Indicators