Chip LED EZ400-p

coloredmounting pad

Cree LED's EZBright® LEDs are the latest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree LED's proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. EZ™ LEDs are attachable with the flux eutectic method, as well as conductive epoxy, solder paste or solder preforms. These vertically structured, low forward voltage LED chips are available in standard or reduced height. Cree LED's EZ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of applications, including automotive lighting, wearable devices, video displays and LCD backlighting. FEATURES: • Lambertian Radiation Pattern • Anode-up design (p-pad up) • EZBright LED Technology, binned @ 175 mA • 450 nm: 180+ mW • 460 nm: 180+ mW • 470 nm: 160+ mW • 527 nm: 40+ mW • Forward Voltage (Vf): 3.4 V Typical at 175 mA • Maximum DC Forward Current: 200 mA • Backside Metal versions for various attach methods: • A (AuSn) for use with Conductive Adhesives, Flux Eutectic Attach, Solder Paste & Solder Preforms • H (Au) for Conductive Adhesives (i.e. Ag paste) • 2kV Class 2 ESD Rating APPLICATIONS • - General Illumination - - Aircraft - - Decorative Lighting - - Task Lighting - - Outdoor Illumination • - White LEDs • - Wearable Devices • - Projection Displays • - Automotive Interior • - Automotive Exterior Mobile Flash