Cree LED’s EZBright® LED chips are the latest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree LED’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. EZ™ LED chips are attachable with the flux eutectic method, as well as conductive epoxy, solder paste or solder preforms. These vertically structured, low forward voltage LED chips are approximately 220 mm in height. Cree LED’s EZ chips are tested for conformity to optical and electrical specifications. These LED chips are useful in a broad range of applications, including automotive lighting, general illumination and mobile flash.
FEATURES
• Lambertian Radiation Pattern
• Anode-up design (p-pad up)
• EZBright LED Technology (350 mA)
– 450 nm – 660+ mW
– 460 nm – 600+ mW
– 470 nm – 580+ mW
– 527 nm – 340+ mW
• Low Forward Voltage (Vf) – 2.85 V typ
• Max DC Forward Current – 2000 mA
• 250V, Class 1A ESD Rating
• Backside Metal options:
– AuSn for Flux Eutectic Attach,
Conductive Adhesives, Solder Paste
and Solder Preforms
– LTDA for Low Temperature Flux
Eutectic Attach
APPLICATIONS
• General Illumination
– Aircraft
– Decorative Lighting
– Task Lighting
– Outdoor Illumination
• White LEDs
• Projection Displays
• Automotive Lighting
– Headlamps
– Daytime Running Lights
– Fog lamps
– After-market Indicators
• Mobile Flash