Cree LED’s EZBright® LED Chips are the latest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree LED’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and
enables a Lambertian radiation pattern.
EZ™ LED Chips are attachable with the flux eutectic method, as well as conductive epoxy, solder paste or solder preforms. These vertically structured, low forward voltage LED chips are approximately 170 µm in height. Cree LED’s EZ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of applications, including automotive lighting, wearable devices, video displays and LCD backlighting.
FEATURES
• Lambertian Radiation Pattern
• Vertically conductive (one wire bond)
• Anode-up design (p-pad up)
• Binned at 20 mA
• Radiant Flux (RF) performance:
- 450 nm – 36+ mW
- 460 nm – 34+ mW
- 470 nm – 30+ mW
- 527 nm – 16+ mW
• Typical Forward Voltage (Vf) – 2.9V
• Backside Metal:
- AuSn for use with Flux Eutectic
Attach, Conductive Adhesives,
Solder Paste & Solder Preforms
• 2kV Class 2 ESD Rating
APPLICATIONS
• General Illumination
- Aircraft
- Decorative Lighting
- Task Lighting
- Outdoor Illumination
• White LEDs
• Wearable Devices
• Projection Displays
• Automotive Interior