Copper heat sink

extrudedcompactclip-on

Compact, efficient and as mobile as possible: those are the requirements of embedded systems in a nutshell – and of the required cooling solutions. After all, smaller and more efficient heat sinks are needed for fast and reliable dissipation of the increasing power losses in high-end processors. Because long-term operational reliability is ensured only by efficient and effective cooling. Individual Our embedded heat sinks are as unique as the applications they cool. Diversified We use different manufacturing processes depending on the heat sink properties and the required number of heat sinks. Efficient Our heat sink solutions for embedded systems and IPCs are designed for fast dissipation of heat from power losses. The right cooling solution for every system Ideally, embedded systems are cooled directly at the hot spot. The type of cooling solution depends on the degree of power loss and the available installation space. We can implement the following heat sink solutions for your embedded system or IPC: Heat spreader solutions with integrated heat pipes that conduct the heat from the hot spot to the heat sink Copper inlay heat sinks for direct installation at the hot spot Cold extruded pin block heat sinks with a special pin and fin design that enables higher air flow rates than standard extruded heat sinks Soldered finger, clip-on or mini screw-on PCB heat sinks for all standard semiconductor housings Factory-mounted fan units and ready-to-install sets consisting of a heat sink and mounting accessories Specially designed for IPCs: Cooling electronic housings made of metal Many devices give off heat through their housing.