3D measuring instrument Q-400 DIC TCT

non-contactfor the semiconductor industrybenchtop

Solution: The Q-400 TCT system is designed for complete three dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is successfully used in the development and testing of complex (anisotropic) materials, components and structures in electronic applications. Results: The system is ideal for the experimental verification of analytical and numerical calculations. The 3D information enables fast determination of warpage, thermal expansion coefficient and the thermal stress of components such as printed circuits, BGA, Flip Chip’s etc. Benefits: Complete package for thermal investigations. Non-contact measurement performed on the whole measuring area on nearly any material. 3D information provided also on curved surfaces. Measurement of warpage possible.