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Chemical PCB etching machine Infinity PSIBE
vacuumfor the microelectronics industryautomatic

Chemical PCB etching machine - Infinity PSIBE - Denton Vacuum - vacuum / for the microelectronics industry / automatic
Chemical PCB etching machine - Infinity PSIBE - Denton Vacuum - vacuum / for the microelectronics industry / automatic
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Characteristics

Type
chemical, vacuum
Applications
for the microelectronics industry
Other characteristics
automatic

Description

The Infinity PSIBE and the Infinity LL Etch systems delivers high-performance etching, critical thin film profile milling, glancing angle milling and more. Denton Vacuum’s experts will work with you to ensure that your configuration is optimized to meet your exact needs and specifications, and your system will be fully supported by our technical team. Semiconductor process yield improvement with end point control Compound semiconductor Au etch Process control and chip design assessment Patterned etch Wafer processing service The flexible, versatile PSIBE batch system offers a small footprint that’s perfect for tight production floors. It is designed for low-to-mid throughput applications and is a perfect solution for the MEMS, semiconductor, and data storage markets as well as optics, lenses, pilot production and foundry support. The Denton’s Vacuum LL (Load Lock) Etch System is a flexible solution designed to support high-throughput processing for demanding, high-volume applications like pilot production and foundry support in the semiconductor, data storage, MEMS, and wafer processing markets. Both systems are class 1000 cleanroom compatible (ballroom style), ESD compliant and chemical assist is available for etch. LL Etch can be configured for either single chip or multichip and the PSIBE system PSIBE enables cost-effective manual sample transfer with a single wafer load lock.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.