Magnetron sputtering machine Discovery 635

The production-proven Discovery platform can handle substrates up to 300mm. The cluster configuration makes it suitable for multi-layer, oxygen-sensitive applications and high throughput requirements. The platform accommodates DC, pulsed DC, and RF sputtering, which feature the single-cathode configuration for high uniformity, as well as confocal co-sputtering capability. Denton’s proprietary PEM technology enables high rate reactive sputtering of metal oxides and nitrides. Ion assisted deposition is also available. With independent electro-pneumatic source shutters and chimney assemblies, you can prevent cross-contamination of your source material. Multiple pump configurations, including cryogenic and turbo, as well as pump placement options provide the design flexibility we need to meet your process and productivity requirements. High-volume production Advanced optical filters Biocompatible coatings for medical implants Thin film resistors & sensors Wafer metal & dielectric films Large area hybrid circuit fabrication Metal contacts of compound semiconductors Research & development The Discovery Magnetron Sputtering system offers versatility and reliability while meeting high-volume production needs. This thin film deposition system can either accommodate a single cathode high uniformity configuration for high-volume manufacturing, or up to 4 confocal cathodes with triaxis adjustment of offset, target to substrate distance, and angle for uniform coating. Each cathode can be optimized for a different deposition method or target material.