1.High speed; 3-7 times higher than the traditional dispensing
2.Thermostatic system for flow channel and sprayer to ensure the uniformity in glue temperature;
3.Non-contact spray dispensing, greatly increase efficiency
Application Industry:
Semiconductor packaging, PCB electronic parts fixation and protection, mobile phone, notebook shell bonding, LCD glass substrate packaging, led dispensing, optical lens dispensing and packaging, automotive parts coating, chip bonding, hardware parts coating and bonding, battery packaging, horn dispensing, quantitative liquid filling, etc.
Suitable glue:
UV glue, AB glue, epoxy (black glue), white glue, EMI conductive adhesive, silicon, epoxy resin, instant adhesive, silver glue, red glue, solder paste, heat dissipation paste, solder paste, transparent paint, screw fixing agent, etc
Product Description
1. Hand hold LCD screen operation, easy to program, easy to learn and understand.
2. It has the function of drawing point, line, surface, arc, circle, irregular curve and so on to realize any 3D non planar trajectory path.
3. Teaching function, support array, graphical browsing, 3D ellipse, common graphics library insertion, group editing and other advanced functions.
4. Super large capacity 2G high speed miniSD file memory can store 999 dispensing process files.
5. The size and thickness of glue, coating speed, dispensing time and stopping time can be set by parameters.
6. With the special dispensing controller, the glue output is stable, the glue breaking is clean and there is no leakage.