- Machine-tools
- Finishing Machine
- High-speed lapping machine
- Dongguan Kizi Precision Lapping Mechanical Manufacture Co., Ltd
High-speed lapping machine KJ200Lwafer thinningfor hard materials
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Characteristics
- Options
- high-speed
- Applications
- for hard materials, wafer thinning
- Outer diameter
200 mm
(8 in)
Description
It is used for high-speed thinning of brittle and hard materials such as silicon wafers, ceramics, glass, quartz crystals, sapphire, and other semiconductor materials.
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Thinning Machine
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.