Leaf thermally conductive material TGP 2400

electrically insulating

- Thermal Conductivity: 2.4 W/m-K - Low “S-Class” thermal resistance at ultra-low pressures - Ultra conformable, “gel-like” modulus - Designed for low-stress applications - Fiberglass reinforced for puncture, shear and tear resistance BERGQUIST GAP PAD TGP 2400 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K. The material is a filled-polymer material yielding extremely soft, elastic characteristics. The material is reinforced to provide easy handling, converting, added electrical isolation and tear resistance. BERGQUIST GAP PAD TGP 2400 is well suited for low pressure applications that typically use fixed standoff or clip mounting. BERGQUIST GAP PAD TGP 2400 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP 2400 is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly. It is also available with a non-tack side. Please see the “Standard Options” section for description. BERGQUIST GAP PAD TGP 2400 is supplied with protective liners on both sides. The top side has reduced tack for ease of handling. TYPICAL APPLICATIONS - Between processors and heat sinks - Between graphics chips and heat sinks - DVD and CDROM electronics cooling - Area where heat needs to be transferred to a frame, chassis or other type of heat spreader TYPICAL PROPERTIES OF CURED MATERIAL Young's modulus is calculated using 0.01 in/min, step rate of strain with a sample size 0.79 inch².