Leaf thermally conductive material TGP EMI1000

- Thermal Conductivity: 1.0 W/m-K - Electromagnetic Interference (EMI) absorbing - Highly Conformable, low hardness - Fiberglass reinforced for puncture, shear and tear resistance - Electrically isolating BERGQUIST GAP PAD TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating. BERGQUIST GAP PAD TGP EMI1000 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required. BERGQUIST GAP PAD TGP EMI1000 is supplied with a protective liner on the material’s tacky side. TYPICAL APPLICATIONS - Consumer electronics - Telecommunications - ASICs and DSPs - PC applications TYPICAL PROPERTIES OF CURED MATERIAL Young's modulus is calculated using 0.01 in/min, step rate of strain with a sample size 0.79 inch². Relaxation stress @ 40 mil. Physical Properties Hardness, Shore 00, Thirty second delay value , ASTM D2240, Bulk rubber 5 Heat Capacity, ASTM E1269, J/g-K 1.3 Density, Bulk rubber, ASTM D792, g/cc 2.4 Flammability, UL 94 V-0 Young's Modulus, ASTM D575 kPa 69 (psi) (10)