Leaf thermally conductive material TSP Q2000

Thermal impedance: 0.35ºC-in2 /W @ 50 psi Eliminates processing constraints typically associated with grease Conforms to surface textures Easy handling May be installed prior to soldering and cleaning without worry TYPICAL APPLICATIONS Between a transistor and a heat sink Between two large surfaces such as an L-bracket and the chassis of an assembly Between a heat sink and a chassis Under electrically isolated power modules or devices such as resistors, transformers and solid state relays BERGQUIST SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering andcleaning without worry. When clamped between two surfaces, the elastomer conformsto surface textures thereby creating an air-free interfacebetween heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application. TYPICAL PROPERTIES Physical Properties Hardness, Shore A, ASTM D2240 86 Flammability Rating, UL 94 V-0 Electrical Properties Dielectric Breakdown Voltage , ASTM D149, Vac Non-Insulating Dielectric Constant, ASTM D150 @ 1,000 Hz NA Volume Resistivity, ASTM D257, ohm-meter 1×102