Flip-chip die bonder T-3002-M

eutecticmanual

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Tresky’s products, the T-3002-M incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. The M-models are available with or without wafer pick up. Excellent performance, ergonomically designed and high reliability makes the T-3002-M ideal for small and medium production. Typically with a cycle time of approx. 5 sec. (process depending). Die Attach, Die Sorting, Flip-Chip, MEMS, MOEMS, VCSEL, Ultrasonic, Thermosonic, RFID, Adhesive Bonding, Eutectic Bonding (AuAu, .....)